发明名称 METHOD FOR MEASURING FILM THICKNESS, AND INSTRUMENT THEREOF
摘要 PROBLEM TO BE SOLVED: To measure the film thickness of a thin film in a dielectric substance material provided on a base material, using a simple method. SOLUTION: A sample 100, with the thin film 101 of the dielectric substance material provided on the transparent base material 102, is irradiated with an infrared ray of a measuring wavelength in the vicinity of wavelength indicating a peak for the reflectance in a reflection spectrum on the dielectric substance material, and infrared ray of a reference wavelength in a region having no reflectance change; reflectances in the measuring wavelength and the reference wavelength are computed; and the film thickness d of the thin film in the dielectric substance material is calculated, based on the reflectance of the infrared ray of the reference wavelength and the reflectance difference, with respect to the measurement wavelength, varied in response to the film thickness d of the thin film in the dielectric substance material. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005164251(A) 申请公布日期 2005.06.23
申请号 JP20030399563 申请日期 2003.11.28
申请人 KURABO IND LTD 发明人 AZUMA NOBORU;NAKATANI TAKAYUKI
分类号 G01B11/06;(IPC1-7):G01B11/06 主分类号 G01B11/06
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