发明名称 |
METHOD FOR ASSEMBLING SUBSTRATE AND THE APPARATUS THEREFOR |
摘要 |
PROBLEM TO BE SOLVED: To solve problems that substrates horizontally shift and that constitution becomes complicated because the substrates are released from being held by adhesion when an adhesive holding mechanism is used to support the substrates. SOLUTION: Provided is a holding mechanism which is equipped with a plurality of adhesive pads holding the other substrate on a table and a sucking opening having a plurality of friction pads and holding the substrate at the adhesive pad part with a sucking force, and applies the sucking force to project the adhesive pads to the reverse surface of the substrate mounted on a table surface and then holds the adhesive pads on the table when the adhesive pads come into contact with the substrate surface. COPYRIGHT: (C)2005,JPO&NCIPI
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申请公布号 |
JP2005165159(A) |
申请公布日期 |
2005.06.23 |
申请号 |
JP20030406679 |
申请日期 |
2003.12.05 |
申请人 |
HITACHI INDUSTRIES CO LTD |
发明人 |
NAKAYAMA YUKINORI;ENDO MASATOMO;IMAI HIROAKI |
分类号 |
G02F1/1339;G09F9/00;(IPC1-7):G09F9/00 |
主分类号 |
G02F1/1339 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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