| 摘要 |
PROBLEM TO BE SOLVED: To perform minute plating under different conditions for portions on a substrate, and to obtain a plated film having satisfactory intra-plane uniformity by suppressing the influence of sheet resistance on the surface of the substrate to the minimum. SOLUTION: The plating apparatus includes a substrate holder 504 for holding a substrate, a cathode portion 506 including a sealing member 514 to be in contact with the peripheral portion of a surface to be plated of the substrate W held by said substrate holder 504 to seal the peripheral portion water-tightly, and a cathode 512 to be in contact with the substrate W to supply current to the substrate, an anode 526 disposed so as to face the surface to be plated of the substrate W, and a porous member 528 which is disposed between the anode 526 and the surface to be plated of the substrate W, the porous member being made of a water-retentive material, and which has a planar shape smaller than the surface to be plated of the substrate W, an electrode head 502 provided with the anode 526 and the porous member 528 up and down, and a driving mechanism relatively moving the electrode head and the substrate. COPYRIGHT: (C)2005,JPO&NCIPI
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