| 发明名称 |
LOW DIELECTRIC MATERIAL COMPOSITION |
| 摘要 |
PROBLEM TO BE SOLVED: To improve the quality of a coating film formed by coating a composition comprising a borazine ring skeleton-having compound by a coating method. SOLUTION: A solvent represented by formula A [R<SP>a</SP>and R<SP>c</SP>are each identically or differently an alkyl or an acyl; R<SP>b</SP>is H or an alkyl; (n) is an integer of 1 to 5] is used as the solvent of the low dielectric material composition comprising the borazine ring skeleton-having compound. Thereby, the uniformity of the coating film formed by the coating method is improved. COPYRIGHT: (C)2005,JPO&NCIPI
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| 申请公布号 |
JP2005162807(A) |
申请公布日期 |
2005.06.23 |
| 申请号 |
JP20030401200 |
申请日期 |
2003.12.01 |
| 申请人 |
MITSUBISHI ELECTRIC CORP;NIPPON SHOKUBAI CO LTD |
发明人 |
NOBUTOKI EIJI;KUMADA TERUHIKO;YAMAMOTO TETSUYA;KAMIYAMA TAKUYA |
| 分类号 |
C07F5/05;C08G79/08;C08K5/14;C08L85/04;H01L21/312;(IPC1-7):C08L85/04 |
主分类号 |
C07F5/05 |
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