发明名称 Photodiode and method of manufacturing the same
摘要 A photodiode and a method of manufacturing the photodiode are provided. The method includes forming a diode junction structure including a light receiving unit and an electrode unit on a semiconductor substrate, forming a buffer oxide layer and an etching blocking layer on the junction structure, forming an interlayer insulating layer and an intermetal insulating layer and an interconnecting structure, exposing the etching blocking layer by etching the intermetal insulating layer and the interlayer insulating layer, removing a portion of the etching blocking layer and the buffer oxide layer of the light-receiving unit by dry etching, and exposing a semiconductor surface of the light-receiving unit by wet etching.
申请公布号 US2005133838(A1) 申请公布日期 2005.06.23
申请号 US20040002832 申请日期 2004.12.02
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 SON HO-SUNG;BAE SUNG-RYOUL;NAM DONG-KYUN
分类号 H01L31/10;H01L31/0216;H01L31/0232;H01L31/105;(IPC1-7):H01L31/023 主分类号 H01L31/10
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