| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a positive heat resistant photosensitive resin composition having high sensitivity and also ensuring a good pattern shape and a good residual film ratio in an unexposed region and to provide a semiconductor device using the same. <P>SOLUTION: The heat resistant photosensitive resin composition contains (A) a heat resistant resin polymer shown by formula (1) or a precursor thereof, wherein X denotes a divalent organic group; Y denotes a tetravalent organic group; Z denotes a cyclic compound group having no reactive unsaturated bond; R denotes H or a monovalent organic group; and n denotes a number of repeating units of the polymer and is 2-500, (B) a polyamic acid ester having a phenolic hydroxyl group and (C) a photoreactive compound. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
