| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a heat-resistant adhesive capable of preventing the formation of package crack in case of solder reflowing and suitably used for a semiconductor device, without requiring a base material tape, and to provide a semiconductor device obtained by using the heat-resistant adhesive. <P>SOLUTION: The heat-resistant adhesive is used in a method for producing the semiconductor device which comprises forming a film layer of an adhesive on a semiconductor chip, removing a prescribed area of the film layer with an organic solvent so as to form the adhesive into a desired pattern on an active element surface of a semiconductor chip surface, adhering a lead frame to the semiconductor chip by the adhesive formed into the desired pattern on the active element surface of the semiconductor chip surface, and electrically connecting an electrode of the semiconductor chip and the lead frame, wherein the heat-resistant adhesive contains a polyimide which comprises 2,2-bisphthalic acid hexafluoroisopropylidene dianhydride, 4,4'-diamino-3,3',5,5'-tetraisopropyldiphenylmethane, and a siloxane diamine as main components. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
