| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device wherein the circumferential length of an opening can be increased without changing a ratio of area of a cell occupied by patterns and the mechanical strength of a cylinder inside the cell can also be increased, and to provide its manufacturing method. <P>SOLUTION: By forming a slit 10b wherein a wafer is not opened at the center of the pattern, a resist shape image 11, that is, the shape of the opening of the wafer is nearly a cocoon-like one having a constriction at the center, resulting in an increase in circumferential length of the opening without changing the ratio of area of the cell occupied by the patterns. Moreover, since the bottom face of the opening also has nearly a cocoon-like shape having a constriction at the center, the mechanical strength of the opening can be increased. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
