| 摘要 |
PROBLEM TO BE SOLVED: To suppress the rise of the temperature of a heat-generating component by conducting heat generated from the heat-generating component to a surface inverse to a space closed by a printed wiring board and a case and radiating the heat. SOLUTION: At an electric conductor 1 connected with the heat-generating component 3, a heat conductor 5 extending through both of the surfaces of the printed wiring board 2 is provided. The heat generated from the heat-generating component 3 is conducted to a space S2 on the surface inverse to the space S1 closed by the printed wiring board 2 and the case 4 through the electric conductor 1 and the heat conductor 5, and radiated to suppress raising of the temperature of heat-generating component 3. COPYRIGHT: (C)2005,JPO&NCIPI |
