| 摘要 |
PROBLEM TO BE SOLVED: To provide an improved equipment for dealing with a semiconductor wafer. SOLUTION: The equipment comprises an wafer edge grip end effector 100 having a paddle substrate 102 equipped with an end side end and a center side end. A first arc wafer contact pad 105 is arranged at the end side end on the substrate 102. Second and third arc contact pads 108 are arranged adjacently to the center side end on the substrate 102. The wafer contact pads 105 and 108 each comprise a first arc front surface for engagement with the edge of the wafer and a second sloping front surface. The end effector 100 further comprises a movable wafer grip finger 110 arranged between the second and third wafer contact pads on the substrate 102. The movable finger 110 has the first arc front surface for imposing, in contact with the wafer edge, the wafer edge on the first wafer contact pad. An wafer 120 on the substrate 102 is held by it. COPYRIGHT: (C)2005,JPO&NCIPI
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