| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic circuit device which has a fine heat dissipation characteristic and is highly reliable. SOLUTION: According to the electronic circuit device, a circuit board 2 is inserted into a flat metal case 1 with radiation fins, and a metal plate lid is attached to the metal case 1 at the position opposite to the radiation fins. A resin is injected into the metal case 1 through a resin injection hole 7 formed on the side of the metal case 1. Electronic circuit device terminals 5 project from the metal case 1 at the position opposite to the resin injection hole 5, and is covered with a coupler 8 when the resin flows out of the opposite side to the resin injection hole 7. The resin injection hole 7 is provided with a backflow return valve 6. COPYRIGHT: (C)2005,JPO&NCIPI
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