发明名称 ELECTRONIC UNIT AND ITS HEAT RADIATION STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide a heat radiation structure for an electronic unit for compactly achieving reinforcement of a printed circuit board and improvement of heat radiation efficiency. SOLUTION: In an electronic unit 6, stiffening plates/radiators 17, 18 are provided at upper and lower ends of a printed circuit board 12 with a heating component 19 packaged at a predetermined position thereof, and heat generated by the heating component 19 is conducted through a fluid in a heat pipe 21, a heat-conductive sheet 31 or a heat-keeping circulating pipe 41 to the stiffening plates/radiators and radiated into the atmosphere. A plurality of vent holes 17a, 18a are formed on the stiffening plates/radiators 17, 18. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005167102(A) 申请公布日期 2005.06.23
申请号 JP20030406653 申请日期 2003.12.05
申请人 NEC CORP 发明人 OYAMADA TAKASHI
分类号 F28D15/02;H01L23/427;H05K5/00;H05K7/14;H05K7/20;(IPC1-7):H05K7/20 主分类号 F28D15/02
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