摘要 |
PROBLEM TO BE SOLVED: To provide a heat radiation structure for an electronic unit for compactly achieving reinforcement of a printed circuit board and improvement of heat radiation efficiency. SOLUTION: In an electronic unit 6, stiffening plates/radiators 17, 18 are provided at upper and lower ends of a printed circuit board 12 with a heating component 19 packaged at a predetermined position thereof, and heat generated by the heating component 19 is conducted through a fluid in a heat pipe 21, a heat-conductive sheet 31 or a heat-keeping circulating pipe 41 to the stiffening plates/radiators and radiated into the atmosphere. A plurality of vent holes 17a, 18a are formed on the stiffening plates/radiators 17, 18. COPYRIGHT: (C)2005,JPO&NCIPI
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