发明名称 SUBSTRATE MACHINING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a substrate machining device capable of improving machining precision, even when an axis of pulled out long film is tilted to an XY axes of a machining table. SOLUTION: Holes 22a to 22d provided on a guide base 11 are fitted with pins 23a to 23b disposed on a positioning bases 12a, 12b. There is almost no clearance between the hole 22a and the pin 23a, and the holes 22b to 22d and the pins 23b to 23d are loosely fitted with each other. Two reference holes having axes in an X-axis direction are provided on work W. The work W is fixed on a clamp base supported by the guide base 11. A center of the first reference hole provided on the work W is positioned at a reference position on design, and the positioning base 12a is moved. The guide base 11 rotates around the pin 22a, thereby positioning the axis of the work W at a right angle to the X-axis. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005162369(A) 申请公布日期 2005.06.23
申请号 JP20030401713 申请日期 2003.12.01
申请人 HITACHI VIA MECHANICS LTD 发明人 HONDA YUJI;NAGASAWA KATSUHIRO
分类号 B26D7/01;B21D33/00;B23B47/00;B23B47/28;B23K26/10;B23K37/00;B23K37/04;B23Q3/06;B23Q5/22;B23Q7/00;B26F1/16;B65G49/00;B65H20/18;B65H23/032;B65H23/035;H01L21/68;H05K3/00;(IPC1-7):B65H23/035 主分类号 B26D7/01
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