发明名称 |
Spacer for a gate electrode having tensile stress and a method of forming the same |
摘要 |
By reducing a deposition rate and maintaining a low bias power in a plasma atmosphere, a spacer layer, for example a silicon nitride layer, may be deposited that exhibits tensile stress. The amount of tensile stress is controllable within a wide range, thereby providing the potential for forming sidewall spacer elements that modify the charge carrier mobility and thus the conductivity of the channel region of a field effect transistor. |
申请公布号 |
US2005136606(A1) |
申请公布日期 |
2005.06.23 |
申请号 |
US20040987484 |
申请日期 |
2004.11.12 |
申请人 |
RULKE HARTMUT;HUY KATJA;LENSKI MARKUS |
发明人 |
RULKE HARTMUT;HUY KATJA;LENSKI MARKUS |
分类号 |
H01L21/318;H01L21/336;H01L21/8238;(IPC1-7):H01L21/824;H01L21/320;H01L21/476;H01L21/31;H01L21/469 |
主分类号 |
H01L21/318 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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