发明名称 Spacer for a gate electrode having tensile stress and a method of forming the same
摘要 By reducing a deposition rate and maintaining a low bias power in a plasma atmosphere, a spacer layer, for example a silicon nitride layer, may be deposited that exhibits tensile stress. The amount of tensile stress is controllable within a wide range, thereby providing the potential for forming sidewall spacer elements that modify the charge carrier mobility and thus the conductivity of the channel region of a field effect transistor.
申请公布号 US2005136606(A1) 申请公布日期 2005.06.23
申请号 US20040987484 申请日期 2004.11.12
申请人 RULKE HARTMUT;HUY KATJA;LENSKI MARKUS 发明人 RULKE HARTMUT;HUY KATJA;LENSKI MARKUS
分类号 H01L21/318;H01L21/336;H01L21/8238;(IPC1-7):H01L21/824;H01L21/320;H01L21/476;H01L21/31;H01L21/469 主分类号 H01L21/318
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