Method of sputter etching and metal plug of semiconductor device formed by using the same,申请号KR20030022409-传众专利搜索

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发明名称	Method of sputter etching and metal plug of semiconductor device formed by using the same
摘要
申请公布号	KR100497200(B1)	申请公布日期	2005.06.23
申请号	KR20030022409	申请日期	2003.04.09
申请人		发明人
分类号	H01L21/302;(IPC1-7):H01L21/302	主分类号	H01L21/302
代理机构		代理人
主权项
地址

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