| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of connecting metal bumps which enables high-density connection without causing defective connections and short-circuits, and to provide a circuit component with the metal bumps. <P>SOLUTION: On a substrate, solder thin-film patterns 104-1 to 104-8 are formed, and then these patterns are laminated by cold bonding on an electrode pad 204 of an integrated circuit chip 203 to form a solder bump 105 consisting of a laminated structure. Since the fine solder thin-film patterns 104-1 to 104-8 can be formed on the substrate by patterning, a minute solder bump having an excellent profile precision can be obtained by bonding and laminating them, resulting in enabling high-density connection without causing defective connections and short-circuits. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
