| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a visual inspection apparatus for a stud bump which can stably inspect the outer appearance of a bump with no dependency on the variation within a range of acceptable product at the time of bump formation by jointly using ring illumination as well as coaxial illumination. <P>SOLUTION: The bump formed on a semiconductor element 4 and electrode pad 5 is displayed on an image receptor 19 by means of an information processing apparatus 17 using a camera unit which is such that a camera 6 and a bright field objective lens 8 are attached to a microscope tube 7. By jointly using the ring illumination 9, erroneous detection due to the variation in imaged shapes inside the outline of a bump seating 1 due to the variation in shapes within a range of acceptable product of each bump, that is, erroneous detection due to the variation in qualities at the time of bump formation, can be suppressed. Since a depth of field is as shallow as several tens of μm due to the use of the objective lens 8, a degree of flatness of an X-Y inspection stage 13 is measured by a displacement sensor 16 and the result is stored in a storage device 18, and based on the stored degree of flatness, a Z axis 15 to which the camera 6 is attached is moved up and down by means of a motor 14 to keep the depth of field constant. Therefore, the variation in degrees of flatness of the X-Y inspection stage 13, in other words, defocusing of image due to the variation in mechanical precisions of equipment can be suppressed. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
