| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit connection material and the like which can sufficiently reduce a connection resistance between opposed circuit electrodes, and can maintain a reliability of electric characteristics in the connection structure of a circuit member for a long term. SOLUTION: This circuit connection material is formed for connecting circuit members 30, 40 in which edges 33a, 43a of insulating layers 33, 43 are formed more thickly than electrodes 32, 42 on the basis of main surfaces 31a, 41a. The circuit connection material contains an adhesive composition and conductive particles 12 having a particle size A of 10μm or less, a compression X (=100×ä(A-R)/A}) of the conductive particles 12 is not more than parameter D (=100×ä(A-B)/A}), a storage elastic modulus at 40°C by a hardening process is 0.5 to 3 GPa, and an average coefficient of thermal expansion from 25°C to 100°C can be set to 30 to 200 ppm/°C. The R denotes a particle size taken along a pressure direction when compressing and pulverizing the conductive particles, and the reference symbol B denotes a minimum distance between the opposed insulating layers 33 and 43. COPYRIGHT: (C)2005,JPO&NCIPI
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