| 摘要 |
PROBLEM TO BE SOLVED: To provide a fixing method using a thin board fixing jig with a high general-purpose function to eliminate a need of forming an adhesive layer having a controlled peeling strength for every thin board to be processed. SOLUTION: The fixing method for a FPC, or a thin board, using the thin board fixing jig is employed when a flat thin board product having an adhesive layer on one surface thereof is mounted on a device. According to the method, when the thin board is fixed, a (thin) cover film, which has an opening at least at the part that counter to a component mounting part of the thin board, is superposed on the thin board to be fixed together. COPYRIGHT: (C)2005,JPO&NCIPI
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