LIGHT EMITTING DEVICE ARRAY

摘要

PROBLEM TO BE SOLVED: To easily perform a wire bonding process and to improve yield.

SOLUTION: High density work is facilitated by making a structure preventing an increase in the number of p-side electrodes in an LED array. One p-type electrode pad (n-side electrode pad) is formed so that it is connected to n-side contact electrodes of first conductive semiconductor layers in respective islands of the LED array. The n-side contact electrodes of the first conductive semiconductor layers in the respective islands are arranged between light emitters. One n-side electrode pad (n-side electrode pad) is formed in the n-side contact electrode.

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