| 摘要 |
PROBLEM TO BE SOLVED: To provide a communication device in which the influence of high-frequency noise produced from active surfaces of ICs is reduced and of which the sensitivity is improved by appropriately arranging the ICs which are noise sources. SOLUTION: A high-frequency analog IC (91A) and a digital IC (92A) for processing signals, both of which generate high-frequency noise, are mounted on the back (712) of a circuit board (71) with the faces of the ICs down. Namely, the active surfaces (910A and 920A) of the ICs (91A and 92A) do not face to a loop antenna (4) provided integrally with an arm band on the back side of the circuit board (71), but to a liquid crystal panel provided on the front side of the main body of the communication device. Consequently, even when high-frequency noise is produced from the active surfaces of the ICs (91A and 92A), the activity of the communication device is high because noise hardly reaches the loop antenna (4). COPYRIGHT: (C)2005,JPO&NCIPI |
