| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a highly reliable multilayer wiring board capable of realizing a reliable interlayer connection with good productivity. SOLUTION: The multilayer wiring board manufactured according to this method has an interlayer connection part wherein a connection layer having a wiring pattern bonded with an adhesive resin, conductor posts formed on the wiring pattern, and a solder layer formed on the surfaces of the tips of the conductor posts and a layer-to-be-connected having the lands for interlayer connection with the conductor posts are soldered by thermocompression bonding via an adhesive layer. Stable interlayer connection is achieved by heating with a crimping tool capable of controlling the speed of temperature rise upon heating to be not less than 10°C/second and not more than 200°C/second, and further maintaining at the melting point temperature of the solder for a time not less than 3 seconds, so that the highly reliable multilayer wiring board can be obtained. COPYRIGHT: (C)2005,JPO&NCIPI |
