SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device and a manufacturing method thereof whereby an insulation tape base member and a semiconductor element are strongly mounted. SOLUTION: In the semiconductor device in a chip-on film package wherein a bump 6 formed on an inner lead 5 of an organic insulation tape base member 1 and an electrode pad 12 of a chip 11 are bonded by the ultrasonic thermal compression bonding, a corner reinforcement pad 31 is formed to four corners of the chip 11 and a corner reinforcement lead 32 with a reinforcement bump 33 is provided to the organic insulation tape base member 1 corresponding to the corner reinforcement pad 31, and the bump 6 on the inner lead 5 and the electrode pad 12 are bonded, and simultaneously a reinforcement bump 33 on the corner reinforcement pad 31 and a reinforcement lead 32 are bonded by the ultrasonic thermal compression bonding. COPYRIGHT: (C)2005,JPO&NCIPI