发明名称 BUS BAR
摘要 PROBLEM TO BE SOLVED: To provide a bus bar capable of sufficiently suppressing heat diffusion produced at the time of soldering, and capable of soldering rapidly. SOLUTION: The bus bar is formed with a first cutout 4a extending until at least a position beyond a center of a first soldering part 3a, from a second long side 2b to a first long side 2a between mutually adjacent the first soldering part 3a and the second soldering part 3b, in the direction of a short side direction; and a second cutout 4b extending at least a position beyond a center of the first soldering part 3a, from the first long side 2a to the second long side 2b between the first cutout 4a and the second soldering part 3b, in the direction of the short side direction. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005166474(A) 申请公布日期 2005.06.23
申请号 JP20030404278 申请日期 2003.12.03
申请人 TDK CORP 发明人 IKEZAWA TERU;TSUNA TAKAMITSU
分类号 H01R4/02;H01B5/02;H05K7/06;(IPC1-7):H01B5/02 主分类号 H01R4/02
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