| 摘要 |
PROBLEM TO BE SOLVED: To form a thin film excellent in the uniformity of film thickness on a planar substrate surface in a thin film forming apparatus using a spray thermal decomposition method. SOLUTION: At the time when the surface 3a of a previously heated planar substrate 3 is sprayed with the droplets 2 of a raw material solution comprising a thin film raw material and an organic solvent from a raw material solution spraying means 4 to form a thin film on the surface 3a, the planar substrate 3 is heated by a substrate heating means 6 so as to have a temperature distribution corresponding to the amount of the droplets of the raw material solution to be sprayed per unit area in the surface 3a of the planar substrate 3. COPYRIGHT: (C)2005,JPO&NCIPI
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