| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of producing a plated layer by which, particularly, in a form where the lowest layer of the plated layers, or the whole is composed of a gold plated layer, the peeling of resists can be prevented, and the stacked plated layers can be formed at prescribed shape, and to provide a method of producing a connection device using the same. SOLUTION: Liquid resist layers 41 and DFR (dry film resist) layers 42 are formed on a Cu substrate 40, and patterns 41a and 42a with the shape of spiral contacts 20 are formed on the liquid resist layers 41 and DFR layers 42 by exposure development. By interposing each liquid resist layer 41 between the Cu substrate 40 and DFR layer 42, the adhesion between the Cu substrate 40 and the liquid resist layer 41, and between the liquid resist layer 41 and the DFR layer 42 is made satisfactory, and, even if Au plated layers 43 are plating-formed inside the patterns, the peeling of the resists does not occur, and the plated layers with prescribed shape can be formed. COPYRIGHT: (C)2005,JPO&NCIPI
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