发明名称 ETCHING SOLUTION, AND ETCHING METHOD
摘要 PROBLEM TO BE SOLVED: To uniformly etch an aluminum film or its alloy film without generating residue, unevenness or defect in the etching. SOLUTION: An aluminum film or its alloy film 11 or a stacked film of an upper layer composed of aluminum or the alloy thereof and a lower layer composed of a high melting point metal layer is etched with an etching solution comprising, by weight, 50.0 to 80.0% phosphoric acid, 0.5 to 10.0% nitric acid,≤10.0% acetic acid and 0.1 to 2.0% of at least either a fluorine based acid or a chlorine based acid, and water. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005163070(A) 申请公布日期 2005.06.23
申请号 JP20030400843 申请日期 2003.11.28
申请人 SHARP CORP 发明人 NAKAHARA SEI
分类号 C23F1/20;C23F1/26;H01L21/308;(IPC1-7):C23F1/20 主分类号 C23F1/20
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