发明名称 |
Folded fin heat sink assembly |
摘要 |
A folded fin heat sink assembly and a method of fabricating a folded fin heat sink assembly for use as a cooling solution in micro-electronics and/or telecommunication applications. The heat sink assembly is formed by placing a sheet or paste of Sn-Zn solder upon a copper base plate, placing one or more aluminum folded fin assemblies on the solder sheet or paste, heating the base plate, the folded fin assembly and the solder to a temperature exceeding the liquidus temperature of the solder and allowing the solder to flow, and cooling the solder to form a soldered joint between the base plate and the folded fin assembly.
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申请公布号 |
US2005133198(A1) |
申请公布日期 |
2005.06.23 |
申请号 |
US20040926013 |
申请日期 |
2004.08.26 |
申请人 |
ARMSTRONG ROSS D.;ILA ALIN;KHEIL VICTOR |
发明人 |
ARMSTRONG ROSS D.;ILA ALIN;KHEIL VICTOR |
分类号 |
B23K1/00;B23K35/14;B23K35/26;H05K7/20;(IPC1-7):H05K7/20 |
主分类号 |
B23K1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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