发明名称 DEFECT-TOLERANT AND FAULT-TOLERANT CIRCUIT INTERCONNECTIONS
摘要 Methods for increasing defect tolerance and fault tolerance in systems containing interconnected components, in which a signal level is classified as belonging to one of a plurality of different, distinguishable classes based on one or more thresholds separating the signal-level classes, and defect-and-fault tolerant systems embodying the methods. An electronic-device embodiment including an array of nanowire crossbars, the nanoscale memory elements within the nanowire crossbars addressed through conventional microelectronic address lines, and a method embodiment for providing fault-tolerant interconnection interfaces with electrically distinguishable signal levels are described. In the described embodiment, in order to interconnect microelectronic address lines with the nanowire crossbars within the electronic memory, an address encoding technique is employed to generate a number of redundant, parity-check address lines to supplement a minimally required set of address signal lines needed to access the nanoscale memory elements.
申请公布号 WO2005026957(A3) 申请公布日期 2005.06.23
申请号 WO2004US29333 申请日期 2004.09.08
申请人 HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.;KUEKES, PHILIP, J.;WILLIAMS, R., STANLEY;SEROUSSI, GADIEL 发明人 KUEKES, PHILIP, J.;WILLIAMS, R., STANLEY;SEROUSSI, GADIEL
分类号 G06F11/10;G11C8/10;G11C8/20;G11C13/00 主分类号 G06F11/10
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