发明名称 |
Method of forming electrode for saw device |
摘要 |
A method of forming an electrode for a surface acoustic wave (SAW) device comprises the steps of forming an alloy film ( 32 ) made of aluminum (Al) and magnesium (Mg) on a substrate ( 31 ) and selectively etching the alloy film ( 32 ) by using a gaseous mixture composed of BCl<SUB>3</SUB>, Cl<SUB>2</SUB>, and N2 to form the electrode such that the electrode has at least one sidewall polymer film ( 33 ). The method controls the production of hillocks and voids to provide high withstand voltage.
|
申请公布号 |
US6908562(B2) |
申请公布日期 |
2005.06.21 |
申请号 |
US20030351554 |
申请日期 |
2003.01.27 |
申请人 |
OKI ELECTRIC INDUSTRY CO., LTD. |
发明人 |
HAKAMADA SHINICHI |
分类号 |
H01L21/302;C23F4/00;H01L21/3065;H03H3/08;H03H9/02;H03H9/145;(IPC1-7):B29D11/00;B44C1/22 |
主分类号 |
H01L21/302 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|