发明名称 Method of forming electrode for saw device
摘要 A method of forming an electrode for a surface acoustic wave (SAW) device comprises the steps of forming an alloy film ( 32 ) made of aluminum (Al) and magnesium (Mg) on a substrate ( 31 ) and selectively etching the alloy film ( 32 ) by using a gaseous mixture composed of BCl<SUB>3</SUB>, Cl<SUB>2</SUB>, and N2 to form the electrode such that the electrode has at least one sidewall polymer film ( 33 ). The method controls the production of hillocks and voids to provide high withstand voltage.
申请公布号 US6908562(B2) 申请公布日期 2005.06.21
申请号 US20030351554 申请日期 2003.01.27
申请人 OKI ELECTRIC INDUSTRY CO., LTD. 发明人 HAKAMADA SHINICHI
分类号 H01L21/302;C23F4/00;H01L21/3065;H03H3/08;H03H9/02;H03H9/145;(IPC1-7):B29D11/00;B44C1/22 主分类号 H01L21/302
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