| 摘要 |
A method and system for configuring the transmit and receive elements or structures in connector such that crosstalk can be reduced. The connector connects serdes modules in first PCB to serdes modules in one or more second PCBs via a backplane. The connector includes: first and second transmit connection positions in a first direction; first and second receive connection positions; and a ground shield positioned in the first direction between the first and second transmit connection positions and the first and second receive connection positions, wherein the first and second transmit connection positions do not have an interposing ground shield in another direction.
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