发明名称 |
Semiconductor device and method of manufacturing the same, apparatus for manufacturing semiconductor device, circuit boa and electronic instrument |
摘要 |
A method of manufacturing a semiconductor device comprising the steps of: preparing a flexible substrate which includes a base substrate having a light transmission property and an interconnecting pattern formed on one surface of the base substrate, the flexible substrate allowing a light to pass through a region other than the interconnecting pattern; recognizing a position of the interconnecting pattern by viewing the flexible substrate from a surface opposite to the surface on which the interconnecting pattern is formed through the base substrate; recognizing positions of electrodes formed on a semiconductor chip from a direction identical to that in recognizing the interconnecting pattern; and aligning the interconnecting pattern with the electrodes to connect the flexible substrate to the semiconductor chip by the face down bonding.
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申请公布号 |
US6908776(B2) |
申请公布日期 |
2005.06.21 |
申请号 |
US20020238771 |
申请日期 |
2002.09.11 |
申请人 |
SEIKO EPSON CORPORATION |
发明人 |
HASHIMOTO NOBUAKI |
分类号 |
H01L21/60;H01L23/498;(IPC1-7):H01L21/58;H01L21/68 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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