发明名称 Techniques for making a circuit board with improved impedance characteristics
摘要 A circuit board has a first signal layer having a set of conductors, a second signal layer having a conductive plane and a non-conductive region, and a third signal layer having a conductive region that mirrors the non-conductive region of the second signal layer. The circuit board further includes a first separating layer having non-conductive material which is disposed between the first signal layer and the second signal layer, and a second separating layer having non-conductive material which is disposed between the second signal layer and the third signal layer. Accordingly, traces within the first signal layer and overlying the conductive plane of the second signal layer will have a first impedance, while traces within the first signal layer and overlying the non-conductive region of the second signal layer and the conductive region of the third signal layer will have a second impedance that is different than the first impedance.
申请公布号 US6909052(B1) 申请公布日期 2005.06.21
申请号 US20020226845 申请日期 2002.08.23
申请人 EMC CORPORATION 发明人 HAUG DARRIN J.;BARNEY BRANDON
分类号 H05K1/00;H05K1/02;H05K7/06;(IPC1-7):H05K7/06 主分类号 H05K1/00
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