| 摘要 |
<p>The invention concerns a method, using a laser radiation beam, for eliminating defects located within a laminated device consisting of at least one first substrate and at least one second substrate, said laminate incorporating between said first and second substrate at least one intelligent active system. Said method comprises a phase which consists in locating at least one defect located within the active system, a phase of ablation of the defect which consists in circumscribing same with said laser beam.</p> |
