| 发明名称 |
Positive photosensitive resin composition, process for its preparation, and semiconductor devices |
| 摘要 |
The present invention provides a positve photosensitive resin composition of high sensitivity which can form a pattern of high resolution and high residual film ration and which can give a cured film superior in mechanical properties, adhesivity and water absorptivity. That is, the present invention lies in a positive photosensitve resin compostion comprising 100 parts by weight of an alkali-soluble resin, 1 to 100 parts by weight of a photosensitve diazoquinone compound (B) and a filler (C), characterized in that content F of the filler (C) represented by the following formula is 2 to 70% by weight. <?in-line-formulae description="In-line Formulae" end="lead"?>F=filler(C)/[alkali-soluble resing+filler (C)]<?in-line-formulae description="In-line Formulae" end="tail"?> |
| 申请公布号 |
US6908717(B2) |
申请公布日期 |
2005.06.21 |
| 申请号 |
US20030415234 |
申请日期 |
2003.04.25 |
| 申请人 |
INTEL CORPORATION |
发明人 |
HIRANO TAKASHI;OKAAKI SHUSAKU;GOODNER MICHAEL D.;MEAGLEY ROBERT P. |
| 分类号 |
G03F7/004;G03F7/022;G03F7/023;(IPC1-7):G03F7/023 |
主分类号 |
G03F7/004 |
| 代理机构 |
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