发明名称 |
Embedded capacitors using conductor filled vias |
摘要 |
Embedded capacitors and a method for manufacturing the embedded capacitors. The method can include the steps of forming at least one bore ( 115 ) in a dielectric substrate ( 100 ). The dielectric substrate can be mechanically punched or laser cut to form the bore. The bore can be filled with a conductive material ( 250 ) to form a first electrode ( 470 ). A conductor ( 360 ) can be formed on the dielectric substrate, the conductor not being electrically continuous with the first electrode. A depth and/or cross sectional area of the bore can be selected to provide a desired amount of capacitive coupling between the electrode and the conductor. At least a second bore can be formed in the dielectric substrate and filled with a conductive material to form a second electrode. The second electrode can be electrically connected to the first electrode.
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申请公布号 |
US6908809(B1) |
申请公布日期 |
2005.06.21 |
申请号 |
US20040816637 |
申请日期 |
2004.04.02 |
申请人 |
HARRIS CORPORATION |
发明人 |
PROVO TERRY M.;THOMSON ANDREW J. |
分类号 |
H01G4/20;H01G4/26;H01L21/425;H01L21/4763;H01L21/8242;H01L23/498;H01P3/06;H05K1/16;H05K3/40;H05K3/46;(IPC1-7):H01L21/824 |
主分类号 |
H01G4/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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