Grounded embedded flip chip RF integrated circuit

摘要

A system for packaging an integrated circuit amplifier bonds the integrated circuit to metallization lines in a substrate surface with solder balls, the contacts of the integrated circuit being on a top surface and the opposite surface of the integrated circuit being adjacent to a set of vias for conducting heat away from the circuit into the ambient; the material for the material disposed about the integrated circuit being deposited in powder form and later solidified.