| 摘要 |
A method and apparatus for bending a substantially rigid substrate ( 22 ) having first and second portions ( 28, 30 ) interconnected by a bend region ( 32 ). The apparatus comprises first and second heated die members ( 60, 80 ). The first heated die member ( 60 ) has a longitudinal body portion ( 62 ) and an outer edge portion ( 64 ) that extends along the longitudinal body portion ( 62 ) and is substantially rounded. The second heated die member ( 80 ) has a longitudinal body portion ( 82 ) and a groove ( 84 ) that extends along the longitudinal body portion ( 82 ). The first and second heated die members ( 60, 80 ) are configured to contact the substrate ( 22 ) and are capable of bending the substrate ( 22 ) in the bend region ( 32 ) when the outer edge portion ( 64 ) of the first heated die member ( 60 ) slides into the groove ( 84 ) of the second heated die member ( 80 ). There is also a method for bending the substantially rigid substrate ( 22 ).
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