发明名称 Resin encapsulation system
摘要 In a resin encapsulation system, one or more middle molds remain free without being mechanically connected with an upper mold and a lower mold. The middle mold is circulated, by a middle-mold conveying mechanism, among a molding press, a middle-mold preheating unit, a middle-mold cleaning unit, and an ejecting pressing unit adapted to separate an encapsulated object, a runner, and a gate from the middle mold. Resin encapsulation molding is performed in the circulating process described above.
申请公布号 US6908293(B2) 申请公布日期 2005.06.21
申请号 US20020140055 申请日期 2002.05.08
申请人 ASAHI ENGINEERING K.K. 发明人 FURUTA ICHIROU;KAJIWARA AKIRA
分类号 B29C45/26;B29C45/02;B29C45/14;B29L31/34;H01L21/00;H01L21/56;(IPC1-7):B29C45/14;B29C70/72 主分类号 B29C45/26
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