IC CHIP MOUNTING SUBSTRATE, SUBSTRATE FOR MOTHERBOARD, OPTICAL COMMUNICATION DEVICE, METHOD FOR MANUFACTURING IC CHIP MOUNTING SUBSTRATE, AND METHOD FOR MANUFACTURING SUBSTRATE FOR MOTHERBOARD

摘要

PROBLEM TO BE SOLVED: To provide an IC chip mounting substrate where an optical element is mounted and an optical signal passing area is provided and which has superior connection reliability. SOLUTION: Disclosed is the IC chip mounting substrate which has a conductor circuit and an inter-layer resin insulating layer laminated on both its surfaces and also has a solder resist layer formed as an outermost layer, and is mounted with the optical element. The IC chip mounting substrate is characterized in that: an optical path for optical signal transmission is formed in at least the inter-layer resin insulating layer and solder resist layer; a resin composition is charged in the optical path for optical signal transmission except a part penetrating the solder resist layer; and the cross-section diameter of the part of the optical path for optical signal transmission which penetrates the solder resist layer is smaller than that of the part formed in the inter-layer resin insulating layer. COPYRIGHT: (C)2005,JPO&NCIPI