发明名称 |
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To enable the microfabrication of a semiconductor device, and to achieve stable memory cell characteristics. SOLUTION: A method of manufacturing a semiconductor device comprises processes of forming a trap film 102 on a semiconductor substrate 101; forming a hard mask 103 having a composition different from that of the trap film near the surface thereof on the trap film; selectively removing at least part of the hard mask 103 with a photo resist 104 as a mask; removing the photo resist; forming a diffusion layer 105 of a conductivity type opposite from that of the semiconductor substrate in the semiconductor substrate by ion implantation using the hard mask; removing the hard mask; and after washing the surface of the semiconductor substrate using a chemical, oxidizing at least part of the surface of the diffusion layer by heat treatment in an atmosphere containing oxygen, and activating the diffusion layer. COPYRIGHT: (C)2005,JPO&NCIPI
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申请公布号 |
JP2005158853(A) |
申请公布日期 |
2005.06.16 |
申请号 |
JP20030392030 |
申请日期 |
2003.11.21 |
申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
ARAI MASATOSHI;YOSHIDA KOJI |
分类号 |
H01L21/8247;H01L27/115;H01L29/788;H01L29/792;(IPC1-7):H01L21/824 |
主分类号 |
H01L21/8247 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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