发明名称 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To enable the microfabrication of a semiconductor device, and to achieve stable memory cell characteristics. SOLUTION: A method of manufacturing a semiconductor device comprises processes of forming a trap film 102 on a semiconductor substrate 101; forming a hard mask 103 having a composition different from that of the trap film near the surface thereof on the trap film; selectively removing at least part of the hard mask 103 with a photo resist 104 as a mask; removing the photo resist; forming a diffusion layer 105 of a conductivity type opposite from that of the semiconductor substrate in the semiconductor substrate by ion implantation using the hard mask; removing the hard mask; and after washing the surface of the semiconductor substrate using a chemical, oxidizing at least part of the surface of the diffusion layer by heat treatment in an atmosphere containing oxygen, and activating the diffusion layer. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005158853(A) 申请公布日期 2005.06.16
申请号 JP20030392030 申请日期 2003.11.21
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 ARAI MASATOSHI;YOSHIDA KOJI
分类号 H01L21/8247;H01L27/115;H01L29/788;H01L29/792;(IPC1-7):H01L21/824 主分类号 H01L21/8247
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