发明名称 ELECTROMAGNETIC WAVE SHIELDING RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide an electromagnetic wave shielding resin composition exhibiting an excellent electromagnetic wave shielding performance but not causing a quality degradation in signals transmitting through wiring patterns in high-frequency regions beyond 1 GHz without the use of any external component. SOLUTION: The electromagnetic wave shielding resin composition is prepared by a method wherein 46 parts of a liquid epoxy resin, 4.5 parts of a latent hardener, 49.5 parts of additives, 1,528 parts of coated particles prepared by providing a ferrite plate on carbonyl iron particles having an average particle diameter of 3μm, and 83 parts of a solvent, are mixed in a mixer and then kneaded in a three-roll mill. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005158956(A) 申请公布日期 2005.06.16
申请号 JP20030394423 申请日期 2003.11.25
申请人 AICA KOGYO CO LTD;RIKOGAKU SHINKOKAI 发明人 EBIHARA KENJI;WAKE HIDETARO;ABE MASANORI
分类号 H05K9/00;(IPC1-7):H05K9/00 主分类号 H05K9/00
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