发明名称 Cu BASED ALLOY FOR THERMAL CONDUCTION, AND ITS PRODUCTION METHOD
摘要 PROBLEM TO BE SOLVED: To provide a Cu based sintered alloy for heat radiation parts having low density, high thermal conductivity and excellent heat radiation properties, and to provide its production method. SOLUTION: The sintered alloy for thermal conduction is a lightweight sintered alloy composed of metal copper particles as the main component, a metal bonding layer having density lower than that of metal copper bonding the metal copper particles each other, and desired pores. The metal bonding layer is composed of a metal or an alloy having density of≤5.0 g/cm<SP>3</SP>, and uses metal Al or an Al alloy. Regarding the sintered alloy for thermal conduction, the solid components composed of the metal copper particles and the metal bonding layer are, by volume ratio, 80 to 95% metal copper particles and 5 to 50% bonding layer. In the method of producing the sintered alloy for thermal conduction, metal copper powder and a metal bonding material having density lower than that of the metal powder are blended/mixed into a raw material powdery mixture, the raw material powdery mixture is subjected to compacting into a compact having a desired shape and a desired porosity, and the compact is heated in a nonoxidizing atmosphere so as to be sintered into a sintered alloy. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005154866(A) 申请公布日期 2005.06.16
申请号 JP20030397586 申请日期 2003.11.27
申请人 NIPPON KAGAKU YAKIN CO LTD 发明人 TANIGUCHI SHINSABUN;TONETA HIROKI
分类号 C22C1/04;C22C1/08;C22C9/01;H01L23/373;(IPC1-7):C22C1/04 主分类号 C22C1/04
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