COPPER ELECTROLYTIC SOLUTION IN MANUFACTURING ELECTROLYTIC COPPER FOIL, AND METHOD FOR MANUFACTURING ELECTROLYTIC COPPER FOIL

摘要

PROBLEM TO BE SOLVED: To provide a copper electrolytic solution in manufacturing an electrolytic copper foil, which imparts a rough surface having the uniform shape and size of crests and small roughness to a deposited foil to be peeled off, without substantially lowering the yield of the deposited foil owing to difficulty of the control for the molecular weight and concentration of protein, and to provide a method for manufacturing the electrolytic copper foil with the use of the solution. SOLUTION: The copper electrolytic solution in manufacturing the electrolytic copper foil includes 2 to 4.5 ppm protein with a number average molecular weight Mnof 1,000 to 2,300. The electrolytic solution preferably includes 60 to 100 g/l Cu2+, 60 to 250 g/l free SO42-, and 0.5 to 2.0 ppm Cl-. The method for manufacturing the electrolytic copper foil uses the above copper electrolytic solution. COPYRIGHT: (C)2005,JPO&NCIPI