CUSTOMIZED MICROELECTRONIC DEVICE AND METHOD FOR MAKING CUSTOMIZED ELECTRICAL INTERCONNECTIONS

摘要

A method and apparatus electrically coupling input/output bond pads (14) that are disposed proximate to one another on a microelectronic device. The apparatus includes a microelectronic device having at least two conductive input/output bond pads (14a and 14b) electrically coupled to an integrated circuit (10) of the microelectronic device and first and second conductive stud balls (32 and 34) bonded to first and second input/output pads (14a and 14b), respectively, and a third conductive stud ball (36) bonded to the first and second conductive stud balls. A wire bonding tool (38) in "stud ball" mode is utilized to bond the conductive stud balls.