发明名称 |
ELECTRONICAL CIRCUIT PACKAGE WITH CAVITY RESONANCE CUT OFF MEMBER |
摘要 |
Electrical circuits (4) operating at high frequencies will, due to their nature often radiate electromagnetic energy. The problem gets worse as the frequency of operation gets higher, as the radiation wavelenght becomes correspondingly shorter, and hence becomes closer to a lenght at which the package itself will be resonant. In order to avoid cavity mode resonance a c ut off member (10) attached to the lid (9) is introduced into the package cavit y (2). The cut off member comprises a dielectric substrate coated with a conductive layer. The package cavity (2) could also be filled with a dielectric filler that makes the package appear electrically larger than its physical dimensions due to the shortening of the wavelenght of the electromagnetic fields within a dielectric of increased dielectric constant.
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申请公布号 |
CA2553664(A1) |
申请公布日期 |
2005.06.16 |
申请号 |
CA20042553664 |
申请日期 |
2004.12.06 |
申请人 |
QINETIQ LIMITED |
发明人 |
POWELL, JEFFREY;APPLEBY, ROGER;MOORE, MARK |
分类号 |
H01L23/552;H01L23/24;H01P1/211;H05K9/00 |
主分类号 |
H01L23/552 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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