| 摘要 |
PROBLEM TO BE SOLVED: To obtain an epoxy resin composition which has excellent soldering resistance and is not released from Ni-containing lead frames on soldering treatment after absorbing moisture, and to provide a semi-conductor device. SOLUTION: The epoxy resin composition for sealing semiconductors is characterized by containing (A) an epoxy resin, (B) a phenolic resin, (C) a curing accelerator, (D) an inorganic filler, and (E) 2-mercaptopyrimidine as essential components. The epoxy resin composition for sealing semiconductors preferably contains the above 2-mercaptopyrimidine in an amount of 0.005 to 2 wt.% based on the total amount of the resin composition. The semiconductor device is characterized by sealing a semiconductor element with the epoxy resin composition. COPYRIGHT: (C)2005,JPO&NCIPI |
