ELECTRODE FOR CONNECTION OF VIA-HOLE HAVING PROJECTED PART AT INTERNAL LAYER SIDE

摘要

PROBLEM TO BE SOLVED: To prevent an increase in resistance in a via hole due to the contraction of conductive paste filling the via hole formed to electrically connect layers. SOLUTION: A projected part toward a conductive paste side is formed to an electrode for connecting both ends of a via hole and thereby the contraction of the conductive paste is dispersed. The depth (height) of the projected part is set to 6μm or more. The conductive paste of the electrode is roughed. For the manufacturing of the electrode having the projected part, a transfer foil process, plating, etching or the like are employed. A circuit is also manufactured together with a land and a pad to which electrodes are formed. COPYRIGHT: (C)2005,JPO&NCIPI