发明名称 WIRING BOARD AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a wiring board which has a cover door conductor, and a through hole conductor or a via hole conductor, wherein connection reliability between the cover door conductor and the through hole conductor or the via hole conductor is enhanced. SOLUTION: A wiring board 21 comprises at least an insulating base body 1 containing a resin, a through hole 3 penetrating the insulating base body 1, a through hole conductor 5 formed at the inner wall of the through hole 3, a wiring conductor 12 formed by extending from the through hole conductor 5 on the surface of the base body 1, a resin 7 filled and embedded in a space formed by the through hole conductor 5, and a cover door conductor 9 clogging the end of the embedding resin 7. The cover door conductor 9 is formed in a projected face shape with respect to the embedding resin 7 side. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005159043(A) 申请公布日期 2005.06.16
申请号 JP20030396141 申请日期 2003.11.26
申请人 KYOCERA CORP 发明人 NISHI KOJI
分类号 H05K3/28;H05K1/11;H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K3/28
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