| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a wiring board that omits a process of removing reverse-surface resin flowing out to a build-up body formation surface of a core substrate when a method of filling a through hole of a cavity of the wiring board having the build-up body on one surface with the reverse-surface resin is employed, and the wiring board using the same. SOLUTION: The wiring board which has the build-up body on the 1st main top surface of the core substrate has a reverse-surface insulating layer formed by depositing a compound material containing a thermosetting material on the 2nd main top surface of the core substrate, has the through hole, formed in the core substrate, filled with a compound material of the same kind with the reverse-surface insulating layer, and further has a 1st insulating layer formed by depositing a compound material of the same kind on the 1st main top surface. Then the remaining build-up body is formed on the 1st main top surface, and the 1st insulating layer is less in film thickness than the reverse-surface insulating layer. COPYRIGHT: (C)2005,JPO&NCIPI |
